The 3rd IEEE International Workshop on Distributed Intelligent Systems (DistInSys)

Abstract

The digital environment is, nowadays, ecosystem of machines that can cooperate in solving articulated tasks is becoming realistic daily. Teams of agents, sensors, and robots are ever more capable to sense the environment, process the gathered information, and act in structured and unstructured scenarios. To deal with complexity and a large amount of produced data, it is necessary to decompose systems into smaller, distributed, efficient, intelligent, and autonomous units responsible for local decision-making and control. Let them explore knowledge stored locally and communicate among themselves only when needed. That solution opens issues when discussing the systems design, data, and knowledge exchange, analysis of proper and optimal coupling of system parts as well as integration of subsystems introducing a completely diverse nature into the overall framework. Given the depth of interests and applications, we invite all interested researchers and engineers to take part in DistInSys 2023. This workshop is in conjunction with the 28th IEEE Symposium on Computers and Communications (ISCC 2023).

Date
22 Feb 2023 09:00 — 13:00
Website
DistInSys 2023
Location
Tunis, Tunisia
Submission Date
18th May, 2023 (firm)
Notification Date
22th May, 2023
Camera-ready
30th May, 2023

Topics of interest

Papers are solicited in all areas of Distributed Intelligent Systems, including, but not restricted to:

  • Distributed Architecture for Machine Learning
  • Multi-Agent and Swarm Robotics Systems
  • Deep Learning, Machine Learning, and Computational Intelligence
  • Autonomous Systems, Vehicles, and Drones
  • Mobile, Pervasive, and Ubiquitous Computing
  • Wireless Sensor Network
  • Sensing and Sensors Network
  • Environmental Monitoring
  • Natural Disaster Management
  • Internet of Things
  • Ambient Intelligence
  • Cyber-Physical Systems
  • Neuromorphic Systems

Submission

In order to download manuscript templates for IEEE conference proceedings, use the following link: https://www.ieee.org/conferences/publishing/templates.html. Papers can be submitted directly to EDAS: https://edas.info/N30881.

Note that accepted papers up to 6 pages will be published with no additional charge. Exceeding pages will be charged an additional fee. Papers exceeding 7 pages will not be accepted. At least one author of each accepted paper is required to register to the conference and present the paper. Only registered and presented papers will be published in the conference proceedings. Accepted papers will be included in the ISCC 2023 proceedings and will be submitted for inclusion to IEEE Xplore. The ISCC proceedings have been indexed in the past by ISI, DBLP and Scopus. This makes the ISCC conference one of the publication venues with very high visibility and impact in both Computer and Communications areas.

Best Paper Award

A “Best Paper Award” Certificate will be conferred on the author(s) of a paper presented at the workshop, selected by the Chairs based on scientific significance, originality, and outstanding technical quality of the paper, as assessed also by the evaluations of the members of the Program Committee.

Program Co-Chairs

  • Roberto Marino, Consiglio Nazionale delle Ricerche, Istituto di Ingegneria del Mare, Rome, Italy
  • Lorenzo Carnevale, Università degli Studi di Messina, Messina, Italy
  • Antonino Galletta, Università degli Studi di Messina, Messina, Italy
  • Edelberto Franco Silva, Universidade Federal de Juiz de Fora, Juiz de Fora, Brazil

Steering Committee

  • Lorenzo Carnevale, Università degli Studi di Messina, Messina, Italy
  • Antonino Galletta, Università degli Studi di Messina, Messina, Italy
  • Edelberto Franco Silva, Universidade Federal de Juiz de Fora, Juiz de Fora, Brazil
  • Mario A.R. Dantas, Universidade Federal de Juiz de Fora, Juiz de Fora, Brazil
  • Massimo Villari, Università degli Studi di Messina, Messina, Italy

Publicity Co-Chair

  • Zhuozhao Li, The University of Chicago, Chicago, United States (North America and Asia lead)

Technical Program Committee

tbd